The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Sep. 08, 2021
Applicant:

Shannon Systems Ltd., Shanghai, CN;

Inventor:

Jiangshan Li, Shanghai, CN;

Assignee:

SHANNON SYSTEMS LTD., Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/18 (2006.01); G06F 1/20 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20409 (2013.01); G06F 1/187 (2013.01); G06F 1/20 (2013.01); H01L 23/4006 (2013.01); H05K 7/20472 (2013.01); H01L 2023/4068 (2013.01);
Abstract

An add-in module is provided. The add-in module includes a substrate, a plurality of first heat sources, a plurality of second heat sources, a heat sink and a heat-dissipation plate. The substrate includes a first substrate surface and a second substrate surface. The first substrate surface is opposite the second substrate surface. The first heat sources are disposed on the first substrate surface. The second heat sources are disposed on the second substrate surface. The heat sink corresponds to the first substrate surface and is thermally connected to the first heat sources, wherein the heat sink includes a heat-sink base and a plurality of heat-dissipation fins, and the heat-dissipation fins are connected to the heat-sink sink base. The heat-dissipation plate corresponds to the second substrate surface and is thermally connected to the second heat sources.


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