The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Jun. 21, 2021
Applicant:

Andreas Stihl Ag & Co. KG, Waiblingen, DE;

Inventors:

Rene Wichert, Durlangen, DE;

Martin Fieseler, Essen, DE;

Assignee:

Andreas Stihl AG & Co. KG, Waiblingen, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/367 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H01L 23/3672 (2013.01); H05K 7/209 (2013.01); H01L 23/3675 (2013.01); H05K 7/20509 (2013.01); H05K 2201/066 (2013.01);
Abstract

The invention is directed to an arrangement for dissipating heat of an electronic component mounted on a circuit board. The arrangement includes a heat sink for dissipating heat of an electronic component. In order for bottom heat of the electronic component to be dissipated, at least one heat-dissipating heat conducting section is configured on the circuit board, wherein the heat sink is connected in a heat transmitting manner to the heat conducting section of the circuit board. The heat sink by way of a foot section bears directly on the heat conducting section of the circuit board. A recess is configured in the base body of the heat sink, wherein the electronic component lies at least partially in the recess.


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