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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11632854 B1

PDFFull Text
Date of Patent:
Apr. 18, 2023

Filed:

May. 10, 2021

Electronic assemblies having embedded passive heat pipes and associated method

Applicant:

Eagle Technology, Llc, Melbourne, FL (US);

Inventor:

Jason Thompson, Melbourne, FL (US);

Assignee:

EAGLE TECHNOLOGY, LLC, Melbourne, FL (US);

Attorney:

Allen, Dyer, Doppelt, + Gilchrist, P.A. Attorneys at Law

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/22 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01); F28D 15/00 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); F21V 29/00 (2015.01); H01L 23/00 (2006.01); H01L 23/34 (2006.01); H01L 23/40 (2006.01); H01L 23/367 (2006.01); H01L 23/427 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H05K 7/20336 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01);
Abstract

An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

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