The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Dec. 07, 2021
Applicant:

Spreadtrum Communications (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Jing Chen, Shanghai, CN;

Cong Liang, Shanghai, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 9/02 (2006.01); H03H 9/15 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1064 (2013.01); H03H 9/02834 (2013.01); H03H 9/1071 (2013.01); H03H 9/1092 (2013.01); H03H 9/15 (2013.01); H03H 9/6423 (2013.01);
Abstract

Embodiments of the present application provide a wafer level surface acoustic wave filter and a package method, the surface acoustic wave filter includes a wafer, an electrode layer, a supporting wall and a cover plate; wherein, the wafer includes a substrate layer and a piezoelectric thin film layer combined together by wafer bonding, the electrode layer is arranged on a surface of the piezoelectric thin film layer, the supporting wall surrounds between the piezoelectric thin film layer and the cover plate to form a sealed cavity; and the cover plate includes at least a first material layer, which uses the same material as the substrate layer.


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