The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Jan. 13, 2021
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Kiyoshi Kansaku, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 3/335 (2006.01); H02M 1/36 (2007.01);
U.S. Cl.
CPC ...
H02M 3/33569 (2013.01); H02M 1/36 (2013.01);
Abstract

Disclosed herein is a semiconductor device configured by packaging a semiconductor chip, including at least one terminal. The semiconductor chip includes a pad connected to the terminal, a voltage clamp unit, and a wiring disposed along an outer periphery of the semiconductor chip and between the voltage clamp unit and the pad. In a case in which the wiring has no broken wire portion, a terminal voltage generated at the terminal is clamped to a clamp voltage by the voltage clamp unit, and in a case in which the wiring has a broken wire portion, the terminal voltage reaches a predetermined voltage higher than the clamp voltage or a predetermined voltage lower than the clamp voltage.


Find Patent Forward Citations

Kansaku, Kiyoshi. (2023). Broken wire protection for semiconductor package or device (U.S. Patent No. 11632050). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11632050

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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