The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Aug. 10, 2021
Applicant:

Mitsui High-tec, Inc., Fukuoka, JP;

Inventors:

Yuji Takeda, Fukuoka, JP;

Katsumi Amano, Fukuoka, JP;

Takashi Fukumoto, Fukuoka, JP;

Assignee:

MITSUI HIGH-TEC, INC., Fukuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 15/12 (2006.01); H02K 1/276 (2022.01); H02K 1/28 (2006.01); H02K 15/03 (2006.01); B29C 45/72 (2006.01); B29C 45/03 (2006.01); B29C 45/14 (2006.01); B29K 705/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
H02K 15/12 (2013.01); B29C 45/03 (2013.01); B29C 45/14008 (2013.01); B29C 45/14467 (2013.01); B29C 45/72 (2013.01); H02K 1/276 (2013.01); H02K 1/28 (2013.01); H02K 15/03 (2013.01); B29K 2705/00 (2013.01); B29L 2031/7498 (2013.01); Y10T 29/49009 (2015.01);
Abstract

There are provided a core unit manufacturing apparatus and a core unit manufacturing method including: a molding device that fills a resin into a space portion in a core body; a resin transfer unit that transfers a resin material to the molding device to supply the resin material thereto; and a core transfer unit that carries the core body in and out of a part between a pair of dies of the molding device. The resin transfer unit and the core transfer unit are arranged such that: the resin transfer unit supplies the resin to the molding device from one side position of side surfaces of the molding device; and the core transfer unit carries the core body in and out of the molding device from the other side position of the side surfaces of the molding device, the other side position being different from one side position.


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