The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Jun. 03, 2020
Hisense Broadband Multimedia Technologies Co., Ltd., Shandong, CN;
Guangchao Du, Shangdong, CN;
Yongzheng Tang, Shandong, CN;
Tao Wu, Shandong, CN;
Jianwei Mu, Shandong, CN;
Shaoshuai Sui, Shandong, CN;
Jihong Han, Shandong, CN;
Sitao Chen, Shandong, CN;
Qian Shao, Shandong, CN;
HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Qingdao, CN;
Abstract
This application provides an optical module, and relates to the field of optical communication. An optical module provided in the embodiments of this application includes a laser box and a silicon photonic chip that are enclosed and packaged by an upper enclosure part and a lower enclosure part. The laser box is disposed on and is in contact with the surface of the silicon photonic chip by the side wall or the base. The laser chip is disposed on the top plane of the laser box. The top plane is in contact with the upper enclosure part for heat dissipation, so as to help heat generated by the laser chip be conducted to the upper enclosure part via the top plane, so that the heat generated by the laser chip is dissipated not via the silicon photonic chip.