The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Feb. 16, 2018
Applicant:

Wake Forest University, Winston-Salem, NC (US);

Inventors:

David L. Carroll, Winston-Salem, NC (US);

Chaochao Dun, Winston-Salem, NC (US);

Corey Hewitt, Winston-Salem, NC (US);

Robert Summers, Clemmons, NC (US);

Assignee:

Other;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01); B82Y 30/00 (2011.01); H01L 35/26 (2006.01); C01B 19/00 (2006.01); H01L 35/34 (2006.01);
U.S. Cl.
CPC ...
H01L 35/26 (2013.01); C01B 19/007 (2013.01); H01L 35/34 (2013.01); C01P 2002/72 (2013.01); C01P 2002/85 (2013.01); C01P 2002/88 (2013.01); C01P 2004/03 (2013.01); C01P 2004/04 (2013.01); C01P 2004/24 (2013.01); C01P 2004/80 (2013.01); C01P 2006/32 (2013.01); C01P 2006/40 (2013.01);
Abstract

Composite nanoparticle compositions and associated nanoparticle assemblies are described herein which, in some embodiments, exhibit enhancements to one or more thermoelectric properties including increases in electrical conductivity and/or Seebeck coefficient and/or decreases in thermal conductivity. In one aspect, a composite nanoparticle composition comprises a semiconductor nanoparticle including a front face and a back face and sidewalls extending between the front and back faces. Metallic nanoparticles are bonded to at least one of the sidewalls establishing a metal-semiconductor junction.


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