The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Feb. 03, 2020
Murata Manufacturing Co., Ltd., Kyoto, JP;
Motoji Tsuda, Kyoto, JP;
Takanori Uejima, Kyoto, JP;
Yuji Takematsu, Kyoto, JP;
Katsunari Nakazawa, Kyoto, JP;
Masahide Takebe, Kyoto, JP;
Shou Matsumoto, Kyoto, JP;
Naoya Matsumoto, Kyoto, JP;
Yutaka Sasaki, Kyoto, JP;
Yuuki Fukuda, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A high-frequency module includes a mounting substrate having main surfacesanda first circuit component mounted on the main surfacea second circuit component mounted on the main surfacean external connection terminal arranged on the main surfaceside relative to the main surfacewith respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surfaceside relative to the main surfacewith respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.