The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Jun. 11, 2021
Applicant:
Olympus Corporation, Tokyo, JP;
Inventor:
Hiroshi Kobayashi, Nagano, JP;
Assignee:
OLYMPUS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/1308 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/81801 (2013.01);
Abstract
A bonded body includes: a first base body including a first wiring, a first electrode made of an electroplating film and including a first surface having a first region covering a periphery of an end portion of the first wiring and a second region covering the end portion of the first wiring, and a first passivation layer made of an insulating material and covering a periphery of the first electrode; a second base body including a second electrode; and solder disposed between the first region of the first electrode and the second electrode.