The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Oct. 24, 2019
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Takahiro Okada, Kyoto, JP;
Kazushige Sato, Kyoto, JP;
Takafumi Kanno, Kyoto, JP;
Nobumitsu Amachi, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4853 (2013.01); H01L 21/568 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/35121 (2013.01);
Abstract
A circuit module () includes a circuit board () having a main surface (), an electronic component () mounted on the main surface (), and a sealing resin () covering at least part of the electronic component () on the main surface (). A recess () is formed on at least part of a side surface () of the sealing resin (). At least the recess () is covered with an electrically conductive film ().