The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Jun. 07, 2021
Applicant:

Ceramtec Gmbh, Plochingen, DE;

Inventors:

Alfred Thimm, Wunsiedel, DE;

Harald Kress, Langenzenn, DE;

Assignee:

CERAMTEC GMBH, Plochingen, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 23/46 (2006.01); H01L 23/15 (2006.01); H05K 7/20 (2006.01); H01L 23/36 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/4867 (2013.01); H01L 23/15 (2013.01); H01L 23/36 (2013.01); H01L 23/3672 (2013.01); H01L 23/49811 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); H05K 7/20409 (2013.01);
Abstract

The invention relates to a module () in which voltages greater than 1,000 V and currents greater than 100 A are applied via supply lines, with an electrically insulating carrier (), with a connection means () which has a material thickness greater than 0.3 mm and is connected to the carrier () via a metallization area () which is delimited by a first end () and a second end (), with electronic components () which are connected to the connection means () as required, and with cooling means (). In order that the power is supplied from the outside via the connection means () directly to the module and thus the bonding processes that are customary in the prior art are omitted and parasitic inductances on the power supply are avoided, the invention proposes that the connection means () protrudes beyond one end () of the metallization area () at least at one point, is not fixed to the carrier () in this area () and has contact means ().


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