The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

May. 26, 2021
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Kiyoshiro Yatagawa, Tokyo, JP;

Satoshi Kobayashi, Tokyo, JP;

Ryosuke Hoshino, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H05K 1/18 (2006.01); H01G 4/12 (2006.01); H01G 4/248 (2006.01); H01G 4/012 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/248 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01);
Abstract

An electronic component includes an element body having a dielectric and an inner electrode. The electronic component also includes at least one external electrode. Each external electrode includes a base layer, a plating layer and a covering layer. The base layer is formed on a plurality of surfaces of the element body to have a plurality of faces facing different directions. The base layer is connected to the inner electrode, and contains a metal. The plating layer is formed on a mounting face of the base layer and on a side face of the base layer to which the inner electrode is connected. The covering layer is formed on at least a portion of a face of the base layer, which is opposite to the mounting face of the base layer. A surface of the covering layer is less wettable than a surface of the plating layer by solder.


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