The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Apr. 29, 2019
Tdk Corporation, Tokyo, JP;
Yoji Tozawa, Tokyo, JP;
Takuo Abe, Tokyo, JP;
Yuma Ishikawa, Tokyo, JP;
Hidekazu Sato, Tokyo, JP;
Takashi Endo, Tokyo, JP;
Masashi Shimoyasu, Tokyo, JP;
Kazuma Takahashi, Tokyo, JP;
TDK CORPORATION, Tokyo, JP;
Abstract
An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.