The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Jul. 20, 2021
Applicant:

Féinics Amatech Teoranta, Tourmakeady, IE;

Inventors:

David Finn, Tourmakeady, IE;

Mustafa Lotya, Cellbridge, IE;

Assignee:

AMATECH GROUP LIMITED, Spiddal County, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01); G06K 19/077 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07722 (2013.01); G06K 19/07756 (2013.01); H01Q 1/2216 (2013.01); H01Q 1/2283 (2013.01); B32B 2425/00 (2013.01);
Abstract

Connection bridges (CBR) for dual-interface transponder chip modules (TCM)may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between Cand C. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).


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