The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Nov. 30, 2019
Applicant:

Honor Device Co., Ltd., Guangdong, CN;

Inventors:

Hua Huang, Guangdong, CN;

Jun Yang, Guangdong, CN;

Zhiguo Zhang, Guangdong, CN;

Haitao Zhen, Guangdong, CN;

Assignee:

Honor Device Co., Ltd., Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); G06F 1/16 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); G06F 1/1624 (2013.01); H05K 7/20972 (2013.01); H05K 7/20981 (2013.01);
Abstract

Embodiments of this application disclose a housing structure and a terminal device. The housing structure includes a bottom shell and a lifting shell. A first end of the bottom shell is connected to a first end of the lifting shell, a second end of the bottom shell and a second end of the lifting shell are spaced by a first distance, and space between the bottom shell and the lifting shell forms a heat dissipation channel. A heat dissipation panel is disposed on the bottom shell, a first surface of the heat dissipation panel is in contact with a heat emitting component, and a second surface of the heat dissipation panel is located in the heat dissipation channel. Therefore, the housing structure provided in the embodiments of this application can better dissipate heat for the heat emitting component in the bottom shell.


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