The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Aug. 17, 2017
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:

Bernard Savord, Andover, MA (US);

Antonia van Rens, Nuenen, NL;

Sotir Ouzounov, Eindhoven, NL;

McKee Poland, Andover, MA (US);

Nik Ledoux, Merrimack, NH (US);

Assignee:

KONINKLIJKE PHILIPS N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01); G01S 7/52 (2006.01); G01S 15/89 (2006.01); A61B 8/08 (2006.01);
U.S. Cl.
CPC ...
G01S 7/5208 (2013.01); A61B 8/44 (2013.01); A61B 8/56 (2013.01); G01S 7/52096 (2013.01); G01S 15/8915 (2013.01); G01S 15/8925 (2013.01); A61B 8/488 (2013.01);
Abstract

An ultrasound probe contains an array transducer and a microbeamformer coupled to elements of the array. The microbeamformer comprises one or more analog ASICs containing transmitters and amplifiers coupled to transducer elements, and one or more digital ASICs containing analog to digital converters and digital beamforming circuitry. The analog ASICs and the digital ASICs are manufactured by different integrated circuitprocesses, with that of the analog ASIC optimized for high voltage analog operation and that of the digital ASICs optimized for high density, low voltage digital circuitry.


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