The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Jan. 17, 2022
Applicant:
Allegro Microsystems, Llc, Manchester, NH (US);
Inventors:
Yen Ting Liu, Hsinchu, TW;
Maxim Klebanov, Palm Coast, FL (US);
Paolo Campiglio, Arcueil, FR;
Sundar Chetlur, Frisco, TX (US);
Harianto Wong, Southborough, MA (US);
Assignee:
Allegro MicroSystems, LLC, Manchester, NH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/09 (2006.01); H01F 41/12 (2006.01); H01F 41/04 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
G01R 33/098 (2013.01); G01R 33/093 (2013.01); H01F 27/2804 (2013.01); H01F 27/32 (2013.01); H01F 41/041 (2013.01); H01F 41/12 (2013.01);
Abstract
In one aspect, a method includes forming a metal layer on a substrate, wherein the metal layer comprises a first coil, forming a planarized insulator layer on the metal layer, forming at least one via in the planarized insulator layer, depositing a magnetoresistance (MR) element on the planarized insulator layer, and forming a second coil extending above the MR element. The at least one via electrically connects to the metal layer on one end and to MR element on the other end.