The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Dec. 16, 2021
Hitachi Metals, Ltd., Tokyo, JP;
Yohei Shirakawa, Tokyo, JP;
HITACHI METALS, LTD., Tokyo, JP;
Abstract
A multi-core cable testing device is configured to specify a correspondence between ends of an insulated wire at both ends of a multi-core cable including insulated wires. The device includes a signal input unit for inputting a test signal by capacitive coupling into one end of the insulated wire as a testing object at one end of the multi-core cable, a signal output unit for outputting the test signal by capacitive coupling from each end of the insulated wires at the other end of the multicore cable, a correspondence specifying unit for measuring a voltage of the test signal from the signal output unit and for specifying an other side end of the insulated wire based on a measured voltage. At least one of the signal input unit and the signal output unit includes a signal transmission cable for transmitting the test signal and a substrate configured to be connected to the signal transmission cable. The substrate includes a first electrode to be connected to a signal conductor of the signal transmission cable on one main surface of the substrate, and a second electrode to be capacitively coupled to an end of the insulated wire on the other main surface. A transmission path for transmitting the test signal between the first electrode and the second electrode is provided within the substrate, and a shielding layer is provided at the substrate.