The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Dec. 22, 2020
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka, JP;

Inventors:

Tsutomu Kono, Kawasaki, JP;

Yuuki Okamoto, Hitachinaka, JP;

Takeshi Morino, Hitachinaka, JP;

Keiji Hanzawa, Mito, JP;

Assignee:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); G01F 15/16 (2006.01); G01F 1/684 (2006.01); G01F 1/692 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
G01F 15/16 (2013.01); G01F 1/684 (2013.01); G01F 1/6842 (2013.01); G01F 1/692 (2013.01); H01L 23/495 (2013.01); H01L 29/84 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A flow sensor includes a semiconductor, an electric control circuit, a lead frame, and a spacer. The spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween. A surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed. At the joint portion, the semiconductor device is attached to the lead frame via an adhesive.


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