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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11629395 B1

PDFFull Text
Date of Patent:
Apr. 18, 2023

Filed:

Dec. 02, 2020

Hot stamping component and method of manufacturing the same

Applicant:

Hyundai Steel Company, Incheon, KR;

Inventors:

Hye Jin Kim, Incheon, KR;

Kyu Yeon Hwang, Incheon, KR;

Hyun Yeong Jung, Incheon, KR;

Jin Ho Lee, Gyeonggi-do, KR;

Seung Pill Jung, Incheon, KR;

Assignee:

Hyundai Steel Company, Incheon, KR;

Attorney:

Fox Rothschild LLP

Primary Examiner:

Daniel J Schleis

Int. Cl.
CPC ...
C23C 2/02 (2006.01); B21D 22/02 (2006.01); B21D 37/16 (2006.01); B32B 15/01 (2006.01); C21D 1/673 (2006.01); C22C 38/00 (2006.01); C23C 2/26 (2006.01); C23C 2/12 (2006.01); C23C 2/40 (2006.01); C23C 2/28 (2006.01); F27B 9/02 (2006.01);
U.S. Cl.
CPC ...
C23C 2/02 (2013.01); B21D 22/022 (2013.01); B21D 37/16 (2013.01); B32B 15/012 (2013.01); C21D 1/673 (2013.01); C22C 38/00 (2013.01); C23C 2/12 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/40 (2013.01); F27B 9/028 (2013.01);
Abstract

Disclosed is a hot-stamping component, which includes a base steel plate; and a plated layer on the base steel plate and including a first layer, a second layer, and an intermetallic compound portion having an island shape in the second layer, wherein the first layer and the second layer are sequentially stacked, and an area fraction of the intermetallic compound portion with respect to the second layer is an amount of 20% to 60%.

Find Patent Forward Citations

Kim, Hye. (2023). Hot stamping component and method of manufacturing the same (U.S. Patent No. 11629395). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11629395

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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