The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Apr. 02, 2019
Applicant:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Inventors:
Katsushi Hamakubo, Osaka, JP;
Yuya Homma, Osaka, JP;
Assignee:
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/02 (2006.01); C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C09D 175/14 (2006.01); C09D 7/40 (2018.01); C03C 25/47 (2018.01); C09D 7/62 (2018.01); C03C 13/04 (2006.01); C03C 25/1065 (2018.01); C03C 25/326 (2018.01); C03C 25/48 (2006.01); C08G 18/12 (2006.01); C08G 18/48 (2006.01); C08G 18/66 (2006.01); C08G 18/67 (2006.01); C08G 18/76 (2006.01); C08K 3/36 (2006.01); C08K 9/04 (2006.01); C09D 4/00 (2006.01);
U.S. Cl.
CPC ...
C09D 175/14 (2013.01); C03C 13/04 (2013.01); C03C 25/1065 (2013.01); C03C 25/326 (2013.01); C03C 25/47 (2018.01); C03C 25/48 (2013.01); C08G 18/12 (2013.01); C08G 18/4825 (2013.01); C08G 18/6666 (2013.01); C08G 18/6755 (2013.01); C08G 18/7614 (2013.01); C08K 3/36 (2013.01); C08K 9/04 (2013.01); C09D 4/00 (2013.01); C09D 7/62 (2018.01); C09D 7/68 (2018.01); G02B 6/02395 (2013.01); C03C 2213/00 (2013.01); C08K 2201/005 (2013.01);
Abstract
A resin composition comprises a base resin containing an urethane (meth)acrylate oligomer, a monomer having a phenoxy group, and a photopolymerization initiator, and hydrophobic inorganic oxide particles, wherein the viscosity is 300 mPa·s or more and 4200 mPa·s or less at 45° C. and the content of the monomer having a phenoxy group is 1% by mass or more and 30% by mass or less based on the total amount of the base resin.