The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Oct. 22, 2018
Applicants:

Kornit Digital Ltd., Rosh HaAyin, IL;

Allon Shimoni;

Inventors:

Jacob Mozel, Kfar-Saba, IL;

Muhammad Iraqi, Tira, IL;

Assignee:

Kornit Digital Ltd., Rosh HaAyat, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/54 (2014.01); B41M 5/00 (2006.01); B41M 7/00 (2006.01); C09D 11/037 (2014.01); C09D 11/06 (2006.01); C09D 11/102 (2014.01); C09D 11/322 (2014.01); C09D 11/38 (2014.01); C09D 11/40 (2014.01); D06P 1/52 (2006.01); D06P 1/655 (2006.01); D06P 5/00 (2006.01); D06P 5/30 (2006.01);
U.S. Cl.
CPC ...
C09D 11/54 (2013.01); B41M 5/0047 (2013.01); B41M 7/0018 (2013.01); C09D 11/037 (2013.01); C09D 11/06 (2013.01); C09D 11/102 (2013.01); C09D 11/322 (2013.01); C09D 11/38 (2013.01); C09D 11/40 (2013.01); D06P 1/5292 (2013.01); D06P 1/655 (2013.01); D06P 5/002 (2013.01); D06P 5/30 (2013.01);
Abstract

Provided are compositions and processes formulated and practiced to reduce the friction-coefficient of the printed area and also of the non-printed areas around the image, wherein the compositions are formulated for use by wet-on-wet techniques in-line of the pre-curing printing process, without pretreating the fabric for softness and smoothness prior to the printing process. The compositions comprise at least 15% by weight of a friction-coefficient reduction agent and having a pH lower than 6.5 so as to effect upon contact immobilization of an ink composition that is being digitally applied on the substrate.


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