The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Jun. 19, 2020
Applicant:
Nano Dimension Technologies, Ltd, Nes Ziona, IL;
Inventor:
Alik Belitzky, Rehovot, IL;
Assignee:
Nano Dimension Technologies, Ltd., Nes Ziona, IL;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/102 (2014.01); C08F 2/50 (2006.01); C09D 11/101 (2014.01); B33Y 10/00 (2015.01); B29C 64/112 (2017.01); B29C 64/209 (2017.01); C09D 11/106 (2014.01); C09D 11/38 (2014.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01);
U.S. Cl.
CPC ...
C09D 11/102 (2013.01); B29C 64/112 (2017.08); B29C 64/209 (2017.08); C08F 2/50 (2013.01); C09D 11/101 (2013.01); C09D 11/106 (2013.01); C09D 11/38 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12);
Abstract
The disclosure relates to systems, methods and compositions for fabricating additive manufactured electronics having conductive and dielectric constituents comprising voids, using additive manufacturing. Specifically, the disclosure is directed to the fabrication of three-dimensional component having conductive and dielectric constituents comprising voids by using water soluble support ink, capable of undergoing all processing steps for fabricating the dielectric and conductive constituents.