The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Nov. 20, 2018
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Daniel Florian Acquard, Horseheads, NY (US);

Indrani Bhattacharyya, Ithaca, NY (US);

Sushmit Sunil Kumar Goyal, Painted Post, NY (US);

Prantik Mazumder, Ithaca, NY (US);

Pei-Lien Tseng, Zhubei, TW;

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/06 (2019.01); C03C 27/10 (2006.01); C03C 23/00 (2006.01); B32B 17/06 (2006.01);
U.S. Cl.
CPC ...
C03C 27/10 (2013.01); B32B 7/06 (2013.01); B32B 17/06 (2013.01); C03C 23/006 (2013.01); C03C 23/0075 (2013.01); B32B 2255/24 (2013.01);
Abstract

Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a coating layer comprising a cationic surfactant or a coating layer comprising an organic salt, and associated deposition methods. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (? 500° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.


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