The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Feb. 04, 2022
Applicant:

Beta Air, Llc, South Burlington, VT (US);

Inventors:

Sean Donovan, Richmond, VT (US);

Sarah Kathleen Overfield, Colchester, VT (US);

Stuart Denson Schreiber, Essex, VT (US);

Peter Adam Gottlieb, Wayland, VT (US);

Braedon Lohe, Essex Junction, VT (US);

Herman Wiegman, South Burlington, VT (US);

Assignee:

BETA AIR, LLC, South Burlington, VT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B60L 58/26 (2019.01); B64D 27/24 (2006.01); B60L 50/64 (2019.01);
U.S. Cl.
CPC ...
B60L 58/26 (2019.02); B60L 50/64 (2019.02); B64D 27/24 (2013.01); B60L 2200/10 (2013.01); B60L 2240/36 (2013.01);
Abstract

An apparatus for a ground-based battery management for an electric aircraft is presented. The apparatus includes a battery pack mechanically coupled to the electric aircraft, wherein the battery pack includes at least a battery module, wherein each battery module includes at least a battery unit containing a first row of battery cells, a second row of battery cells, and a thermal conduit disposed between the first row and the second row of the battery unit, wherein the thermal conduit is configured to precondition the battery cells. Each battery module includes a thermal circuit mechanically coupled to the thermal conduit configured to facilitate the precondition using thermal media. The apparatus further includes a media channel encompassing the battery pack configured to connect to a ground cooling component that provides the thermal media to the thermal circuit using the thermal circuit, and evacuate the thermal media using the thermal circuit.


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