The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

May. 01, 2020
Applicant:

Trumpf Laser-und Systemtechnik Gmbh, Ditzingen, DE;

Inventors:

Markus Pieger, Wendlingen am Neckar, DE;

Frederik Schaal, Fellbach, DE;

Simon Dambach, Stuttgart, DE;

Valentin Blickle, Stuttgart, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/245 (2017.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/153 (2017.01); B29C 64/393 (2017.01); B28B 1/00 (2006.01); G01B 11/06 (2006.01); G01B 11/25 (2006.01); B33Y 40/00 (2020.01); B33Y 10/00 (2015.01); B22F 10/28 (2021.01); B22F 12/13 (2021.01); B22F 12/45 (2021.01); B22F 12/49 (2021.01); B22F 12/90 (2021.01); B22F 10/31 (2021.01); B22F 12/41 (2021.01); B22F 12/44 (2021.01); B22F 10/38 (2021.01);
U.S. Cl.
CPC ...
B29C 64/245 (2017.08); B22F 10/28 (2021.01); B22F 10/31 (2021.01); B22F 12/13 (2021.01); B22F 12/45 (2021.01); B22F 12/49 (2021.01); B22F 12/90 (2021.01); B28B 1/001 (2013.01); B29C 64/153 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); G01B 11/0608 (2013.01); G01B 11/254 (2013.01); G01B 11/2518 (2013.01); B22F 10/38 (2021.01); B22F 12/41 (2021.01); B22F 12/44 (2021.01);
Abstract

The disclosure provides methods and systems for measuring a base element of a construction cylinder arrangement in machines for the additive manufacture of 3D objects using a high-energy beam, wherein a measurement pattern is produced from laser light that illuminates the base element, and sites of incidence of the laser light are monitored and evaluated with a camera to produce measuring data about the base element, e.g., position information, orientation information, and/or information about the shape of the surface of the base element. The measurement patterns are produced by deflecting measuring laser beams by an optical scanner system towards the base element, and the camera is arranged laterally offset from the deflected laser beams. The new methods and systems enable measuring base elements in a simple and flexible manner, and require only a small amount of space in the processing chamber.


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