The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Sep. 17, 2020
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Kakeru Sasagawa, Nagano, JP;

Kei Yokota, Nagano, JP;

Kenta Anegawa, Nagano, JP;

Seiichiro Yamashita, Nagano, JP;

Yuji Shinbaru, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/42 (2006.01); B29C 45/17 (2006.01); B29C 45/74 (2006.01); B29C 45/60 (2006.01); B29C 45/62 (2006.01); B29C 45/47 (2006.01);
U.S. Cl.
CPC ...
B29C 45/42 (2013.01); B29C 45/1769 (2013.01); B29C 45/47 (2013.01); B29C 45/60 (2013.01); B29C 45/62 (2013.01); B29C 45/74 (2013.01);
Abstract

An injection molding system includes: an injection molding machine configured to inject a molten material into a mold to mold a molded object; a tray moving unit configured to move a plurality of trays in a work area including a placement position; and a robot configured to place the molded object on a tray moved to the placement position among the plurality of trays. The tray moving unit moves a tray after placement, which is a tray on which the molded object is placed by the robot, from the placement position to a position different from the placement position in the work area, and moves a tray before the placement, which is a tray on which the molded object is not yet placed by the robot, from a position different from the placement position in the work area to the placement position.


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