The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

May. 20, 2021
Applicant:

Fujifilm Business Innovation Corp., Tokyo, JP;

Inventors:

Masashi Matsumoto, Kanagawa, JP;

Mitsuhiro Nakamura, Kanagawa, JP;

Takayuki Uchiyama, Kanagawa, JP;

Takumi Uegane, Kanagawa, JP;

Satoko Monoe, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 15/00 (2006.01); B31F 5/02 (2006.01); B42B 5/00 (2006.01);
U.S. Cl.
CPC ...
B23P 15/00 (2013.01); B31F 5/02 (2013.01); B42B 5/00 (2013.01);
Abstract

A manufacturing method of a staple-less binding unit that includes a first binding unit that has plural recesses and projections and a second binding unit that is arranged to face the first binding unit and has recesses and projections that fit to the recesses and the projections of the first binding unit and in which mediums are bound by being interposed between the first binding unit and the second binding unit in a thickness direction of the mediums includes forming the binding units with a die, adjusting center positions of projecting portions of the binding units formed by the die and removed from the die, and adjusting outer shapes of the projecting portions of which the center positions have been adjusted.


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