The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Mar. 30, 2020
Applicants:

Lm Group Holdings, Inc., Lake Forest, CA (US);

Fabrisonics Llc, Columbus, OH (US);

Inventors:

Evelina Vogli, Lake Forest, CA (US);

John Kang, Lake Forest, CA (US);

Ricardo Salas, Lake Forest, CA (US);

Adam Hehr, Columbus, OH (US);

Assignees:

LM Group Holdings, Inc., Lake Forest, CA (US);

Fabrisonics LLC, Columbus, OH (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 103/18 (2006.01); B23K 20/10 (2006.01); B23K 20/233 (2006.01); B23K 20/24 (2006.01); B23K 26/00 (2014.01); B23K 26/352 (2014.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B23K 20/227 (2006.01); B23K 26/0622 (2014.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); B32B 7/04 (2019.01); C22C 16/00 (2006.01); C22C 14/00 (2006.01); C22C 19/05 (2006.01); C23C 4/067 (2016.01); C23C 4/12 (2016.01); C23C 4/00 (2016.01); C23C 4/04 (2006.01); C23C 30/00 (2006.01); C23C 28/02 (2006.01); C23C 4/08 (2016.01); C23C 4/137 (2016.01); C23C 28/00 (2006.01); C22C 9/00 (2006.01); C22C 45/10 (2006.01); C22C 45/00 (2023.01); B23K 103/04 (2006.01); B23K 103/08 (2006.01); B23K 103/10 (2006.01); B23K 103/14 (2006.01); B33Y 70/10 (2020.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B23K 20/10 (2013.01); B23K 20/106 (2013.01); B23K 20/227 (2013.01); B23K 20/233 (2013.01); B23K 20/2333 (2013.01); B23K 20/24 (2013.01); B23K 26/0006 (2013.01); B23K 26/0622 (2015.10); B23K 26/352 (2015.10); B32B 7/04 (2013.01); B32B 15/013 (2013.01); B32B 15/017 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); C22C 9/00 (2013.01); C22C 14/00 (2013.01); C22C 16/00 (2013.01); C22C 19/058 (2013.01); C22C 45/008 (2013.01); C22C 45/10 (2013.01); C23C 4/00 (2013.01); C23C 4/04 (2013.01); C23C 4/067 (2016.01); C23C 4/08 (2013.01); C23C 4/12 (2013.01); C23C 4/137 (2016.01); C23C 28/02 (2013.01); C23C 28/021 (2013.01); C23C 28/026 (2013.01); C23C 28/40 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); B23K 2103/04 (2018.08); B23K 2103/08 (2018.08); B23K 2103/10 (2018.08); B23K 2103/14 (2018.08); B23K 2103/18 (2018.08); B32B 2307/702 (2013.01); B32B 2311/18 (2013.01); B32B 2311/24 (2013.01); B32B 2311/30 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01); B33Y 80/00 (2014.12); Y10T 428/1275 (2015.01); Y10T 428/12736 (2015.01); Y10T 428/12743 (2015.01); Y10T 428/12806 (2015.01); Y10T 428/12812 (2015.01); Y10T 428/12868 (2015.01); Y10T 428/12917 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/12979 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/24959 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/26 (2015.01); Y10T 428/263 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01);
Abstract

An embodiment relates to an ultrasonic additive manufacturing process, comprising joining a foil comprising a bulk metallic glass to a substrate; and forming a cladded composite comprising the foil and the substrate; wherein a thickness of the cladded composite is greater than a critical casting thickness of the bulk metallic glass, wherein the cladded composite comprises a cladding layer of the bulk metallic glass on the substrate and the bulk metallic glass comprises approximately 0% crystallinity, approximately 0% porosity, less than 50 MPa thermal stress, approximately 0% distortion, approximately 0 inch heat affected zone, approximately 0% dilution, and a strength of about 2,000-3,500 MPa.


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