The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Jun. 30, 2021
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Kenji Horino, Tokyo, JP;

Kazuhiro Yoshidome, Tokyo, JP;

Akihiro Harada, Tokyo, JP;

Hiroyuki Matsumoto, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 9/08 (2006.01);
U.S. Cl.
CPC ...
B22F 9/082 (2013.01); B22F 2009/0872 (2013.01);
Abstract

A metal powder producing apparatus comprising a melted metal supplying part discharging a melted metal, a cylinder body provided below the melted metal supplying part, and a cooling liquid layer forming part forming a flow of a cooling liquid for cooling the melted metal discharged from the melted metal supplying part along an inner circumference face of the cylinder body, wherein the cooling liquid layer forming part has a primary pressure reservoir, and the primary pressure reservoir is provided on an outer circumference part of the cylinder body.


Find Patent Forward Citations

Horino, Kenji. (2023). Manufacturing apparatus for metal powder and manufacturing method thereof (U.S. Patent No. 11628500). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11628500

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…