The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

Mar. 31, 2021
Applicants:

Denso International America, Inc., Southfield, MI (US);

Denso Corporation, Kariya, JP;

Inventors:

Osman Ahmed, Bloomfield Hills, MI (US);

Zaki Hamad, Canton, MI (US);

Jason Summerford, Novi, MI (US);

Riad Ghabra, Northville, MI (US);

Assignees:

DENSO International America, Inc., Southfield, MI (US);

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01Q 1/44 (2006.01); H01Q 1/22 (2006.01); H05K 1/02 (2006.01); H04B 1/38 (2015.01); H01Q 1/48 (2006.01); H04W 4/44 (2018.01); B60R 25/20 (2013.01); H04W 12/06 (2021.01);
U.S. Cl.
CPC ...
H05K 1/0225 (2013.01); B60R 25/20 (2013.01); H01Q 1/48 (2013.01); H04B 1/38 (2013.01); H04W 4/44 (2018.02); H05K 1/18 (2013.01); B60R 2325/105 (2013.01); H04W 12/06 (2013.01); H05K 2201/09163 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A radio frequency (RF) circuit is provided and includes an antenna, a printed circuit board and a RF chip. The printed circuit board includes a stack of layers. The stack of layers includes a grounded layer. The grounded layer includes a slit, a dielectric area, a first grounded area and a second grounded area. The dielectric area includes dielectric material and is disposed between the first grounded area and the second grounded area. The antenna is edge mounted to the ground layer adjacent the dielectric area and offset from a centerline of the ground layer. The second grounded area is disposed between the dielectric area and the slit. The RF chip is mounted to the stack of layers and connected to the antenna via a transmission line and configured to transmit and receive RF signals via the antenna.


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