The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

Jun. 19, 2020
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Yutaka Kishimoto, Nagaokakyo, JP;

Seiji Kai, Nagaokakyo, JP;

Makoto Sawamura, Nagaokakyo, JP;

Yuzo Kishi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/08 (2006.01); H01L 41/338 (2013.01); H03F 3/21 (2006.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01); H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H03H 3/08 (2013.01); H01L 41/338 (2013.01); H03F 3/21 (2013.01); H03H 9/02866 (2013.01); H03H 9/059 (2013.01); H03H 9/1092 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01); H04B 1/40 (2013.01); H03F 2200/451 (2013.01);
Abstract

An acoustic wave device includes a piezoelectric substrate including a support substrate and a piezoelectric layer on the support substrate, the piezoelectric substrate including a first principal surface on the piezoelectric layer side, and a second principal surface on the support substrate side, an IDT electrode on the first principal surface, a support layer on the support substrate, a cover on the support layer, a through-via electrode provided through the support substrate and electrically connected to the IDT electrode, a first wiring electrode on the second principal surface of the piezoelectric substrate and electrically connected to the through-via electrode, and a protective film on the second principal surface to cover at least a portion of the first wiring electrode. The protective film is provided on an inner side of the support layer when viewed in a direction normal or substantially normal to the second principal surface.


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