The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

Jun. 03, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jungmin Lee, Santa Clara, CA (US);

Yu Hsin Lin, Zhubei, TW;

Chung-Chia Chen, Hsinchu, TW;

Ji Young Choung, Hwaseong-si, KR;

Dieter Haas, San Jose, CA (US);

Si Kyoung Kim, Gwangju-si, KR;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 27/32 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5225 (2013.01); H01L 27/3246 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01);
Abstract

Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The sub-pixel circuit includes a plurality of contact overhangs. The plurality of contact overhangs are disposed between adjacent sub-pixels of a sub-pixel circuit to be formed. The contact overhangs are formed over a metal grid exposed through a PDL structure. A cathode is deposited via evaporation deposition to be in contact with the contact overhang. The metal grid is perpendicular to a plurality of metal layers disposed on the substrate.


Find Patent Forward Citations

Loading…