The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

Jun. 04, 2020
Applicant:

Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Gotaro Takemoto, Saitama, JP;

Toshihiro Okuda, Saitama, JP;

Mizue Kitada, Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0623 (2013.01); H01L 29/404 (2013.01); H01L 29/407 (2013.01); H01L 29/66734 (2013.01); H01L 29/7811 (2013.01); H01L 29/7813 (2013.01);
Abstract

A semiconductor device includes: a semiconductor base substrate including a semiconductor layer; a first main electrode; a second main electrode; a plurality of peripheral trenches formed on a surface of the semiconductor layer and having bottom portions covered by the semiconductor layer in a peripheral region; and a plurality of in-trench electrodes each embedded in each of the plurality of peripheral trenches byway of an insulation layer formed on an inner surface of the each peripheral trench, wherein the semiconductor base substrate further includes, in the peripheral region, a plurality of second conductive type floating regions disposed in the semiconductor layer at a depth position deeper than the bottom portions of the peripheral trenches in a spaced apart manner from the peripheral trenches and having a potential in a floating state.


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