The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2023
Filed:
Mar. 26, 2020
Applicant:
Lumileds Llc, San Jose, CA (US);
Inventors:
Tze Yang Hin, Cupertino, CA (US);
Qing Xue, Santa Clara, CA (US);
Assignee:
Lumileds LLC, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 21/768 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 27/153 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/6836 (2013.01); H01L 21/76805 (2013.01); H01L 21/76877 (2013.01); H01L 21/78 (2013.01); H01L 24/81 (2013.01); H01L 27/156 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 33/647 (2013.01); H01L 2021/60067 (2013.01); H01L 2021/60135 (2013.01); H01L 2224/81815 (2013.01); H01L 2933/0066 (2013.01);
Abstract
Methods of manufacture are described. A method includes forming a first cavity in a substrate and placing a backplane in the first cavity. At least one layer of dielectric material is formed over the substrate and the backplane. A second cavity is formed in the at least one layer of the dielectric material to expose at least a portion of a surface of the backplane. A heat conductive material is placed in the second cavity and in contact with the at least the portion of the surface of the backplane.