The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

Feb. 25, 2021
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Akihiko Chiba, Yokohama Kanagawa, JP;

Takahiro Tsurudo, Yokohama Kanagawa, JP;

Kenichi Matoba, Yokohama Kanagawa, JP;

Yoshifumi Shimamura, Yokohama Kanagawa, JP;

Hiroaki Nakasa, Yokohama Kanagawa, JP;

Hiroyuki Takenaka, Kamakura Kanagawa, JP;

Assignee:

KIOXIA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/18 (2023.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/5286 (2013.01); H01L 24/08 (2013.01); H01L 2224/08145 (2013.01); H01L 2924/14511 (2013.01);
Abstract

A semiconductor storage device includes a first semiconductor chip having a first bonding surface; and a second semiconductor chip having a second bonding surface, the second bonding surface being bonded to the first bonding surface. The first semiconductor chip includes a control circuit, a first power line connected to the control circuit and extending in a first direction, and a first pad electrode disposed on the first bonding surface. The second semiconductor chip includes a second power line extending in a second direction, a third power line connected to the second power line and extending in the first direction, a second pad electrode connected to the third power line, and a third pad electrode disposed on the second bonding surface.


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