The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2023
Filed:
Aug. 16, 2021
Applicant:
Aptiv Technologies Limited, St. Michael, BB;
Inventors:
Scott D. Brandenburg, Kokomo, IN (US);
David W. Zimmerman, Noblesville, IN (US);
Assignee:
Aptiv Technologies Limited, St. Michael, BB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); H01L 23/04 (2006.01); H01L 23/29 (2006.01); H01L 23/473 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01L 21/4882 (2013.01); H01L 23/04 (2013.01); H01L 23/293 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H01L 23/473 (2013.01); H01L 23/49816 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10378 (2013.01);
Abstract
An electronic device includes a printed circuit board (PCB) that supports an integrated circuit (IC) chip. The device also includes a lid over the IC chip. A thermal interface material (TIM) is configured to transfer thermal energy from the IC chip to the lid. A heat spreader forms a cavity in communication with the lid. The heat spreader is at least partially filled with a liquid that is configured to change phases during operation of the IC chip.