The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

Jul. 02, 2021
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Yasuhiro Nishisaka, Nagaokakyo, JP;

Mitsuru Ikeda, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); C04B 35/01 (2006.01); H01G 4/008 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); C04B 35/01 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1209 (2013.01); C04B 2235/656 (2013.01);
Abstract

An electronic component includes a multilayer body including a multilayer main body including end surfaces at which internal nickel electrode layers are exposed, side gap portions, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering the end surfaces on which the external nickel layers are provided. A nickel-based oxide and/or a silicon-based oxide are provided between the external nickel layer and the external copper electrode layer. A nickel layer and a tin layer are provided outside the external copper electrode layer. In a cross section passing through a middle of the electronic component in the width direction and extending in the length direction and the lamination direction, a relationship of about 0.2≤Tea/Tem≤about 1.1 is satisfied.


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