The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2023
Filed:
Jul. 09, 2019
Yamaichi Electronics Co., Ltd., Tokyo, JP;
Hiroki Kobayashi, Tokyo, JP;
Yamaichi Electronics Co., Ltd., Tokyo, JP;
Abstract
Provided is an IC socket for a semiconductor capable of preventing adhesion of dust to a photodetection surface provided on an opposite side of a contact surface of an image sensor with no contact with the photodetection surface. The IC socket for a semiconductor includes: a seat () that has an attachment surface () to which an image sensor () is attached; a base () that has a placement surface () on which the seat () is placed and a secured surface () located on an opposite side of the placement surface () and secured to an inspection substrate; and a lid member () that does not come into contact with the image sensor () and that covers a back surface region () on a side of a back surface () of the image sensor () when the image sensor () is attached to the seat ().