The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2023
Filed:
Jun. 05, 2020
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Shigemi Wakabayashi, Nagano, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 167/00 (2006.01); C09J 175/00 (2006.01); B29B 15/00 (2006.01); C09J 175/04 (2006.01); B29B 15/10 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
C09J 175/04 (2013.01); B29B 15/10 (2013.01); C09J 167/00 (2013.01); B29K 2101/12 (2013.01);
Abstract
A fiber body forming method includes a step of applying, to a fiber body containing fibers, a liquid containing a thermoplastic resin which binds the fibers; and a step of heating the fiber body to which the liquid is applied, and in this method, the thermoplastic resin has a glass transition temperature of 10° C. or less, and the thermoplastic resin in the liquid has an average particle diameter of 30 nm or less.
Wakabayashi, Shigemi. (2023). Fiber body forming method and fiber binding liquid (U.S. Patent No. 11624015). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11624015
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile