The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

Jul. 28, 2017
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

David Soriano Fosas, Vancouver, WA (US);

Juan Manuel Zamorano, Sant Cugat del Valles, ES;

Michele Vergani, Sant Cugat del Valles, ES;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01); B29C 64/393 (2017.01); B29K 101/12 (2006.01); B29K 507/04 (2006.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); B29K 2101/12 (2013.01); B29K 2507/04 (2013.01);
Abstract

Examples relate to methods of printing a 3D printed tamper evident security structure for protecting a feature; the method comprising repeatedly: depositing a layer of build material; doping one or more than one region of the layer of build material using a dopant to influence a respective electrical attribute of one or more than one region associated with a graph of the structure; and agglomerating one or more than one selected portion of the layer of the build material, including the one or more than one doped region of the layer of build material, to form progressively the graph with a predetermined measurable electrical characteristic.


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