The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2023
Filed:
May. 04, 2020
Applicant:
Denso Corporation, Kariya, JP;
Inventors:
Akifumi Kurita, Kariya, JP;
Yohei Yoshimura, Kariya, JP;
Ryota Tanabe, Kariya, JP;
Tsuyoshi Arai, Kariya, JP;
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); H01B 1/20 (2006.01); H01R 13/52 (2006.01); H02G 5/06 (2006.01); B29L 31/34 (2006.01); H01L 25/16 (2023.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
B29C 45/14467 (2013.01); B29C 45/14639 (2013.01); H01B 1/20 (2013.01); H01R 13/52 (2013.01); H02G 5/06 (2013.01); B29L 2031/34 (2013.01); H01L 25/16 (2013.01); H02M 7/53871 (2013.01);
Abstract
Performed are an accommodation step of accommodating a pair of conductive members in a die, a sealing step of injecting a resin to seal the conductive members, and an extraction step of extracting a conductive member module. In the sealing step, the conductive members are sealed while a force is applied by the resin injected into the die to the individual conductive members in directions away from each other, and the individual conductive members are supported by support members disposed outside.