The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

Mar. 26, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Taisuke Iwakiri, Tokyo, JP;

Hirotaka Oyama, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01G 2/08 (2006.01); H01G 4/224 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); H02M 7/00 (2006.01); H02M 7/48 (2007.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); H01G 2/08 (2013.01); H01G 4/224 (2013.01); H01L 23/373 (2013.01); H01L 23/473 (2013.01); H02M 7/003 (2013.01); H02M 7/48 (2013.01); H05K 7/209 (2013.01);
Abstract

Provided is a power converter which enables improved performance, and allows each of a semiconductor module and a capacitor module to be more reliably cooled. In a power converter, a capacitor module includes a capacitor module main body facing a cooling surface of a cooler, while being apart from the cooling surface, and a heat conductive member provided in the capacitor module main body. The capacitor module main body is connected to a semiconductor module via an N-side bus bar and a P-side bus bar. A heat radiation portion of the heat conductive member is thermally connected to the cooling surface at a position more distant from the semiconductor module than an end portion of the capacitor module main body which is closer to the semiconductor module.


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