The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2023
Filed:
Aug. 30, 2021
Applicant:
Astee International Limited, Kowloon, HK;
Inventors:
Yu-Wei Chen, New Taipei, TW;
Cheng-Sheng Chen, New Taipei, TW;
Assignee:
Astec International Limited, Kowloon, HK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 7/08 (2006.01); H04B 7/06 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); F28F 13/06 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); F28F 13/06 (2013.01); H05K 1/0201 (2013.01); H05K 1/181 (2013.01); F28F 2215/08 (2013.01); F28F 2250/10 (2013.01); F28F 2275/00 (2013.01); H05K 2201/066 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10166 (2013.01);
Abstract
A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.