The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

Aug. 24, 2021
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Bo Cheng, Malden, MA (US);

Charles Tuffile, Swansea, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1233 (2013.01); H05K 3/1225 (2013.01); H05K 3/4053 (2013.01); H05K 2203/0139 (2013.01);
Abstract

A method for printing conductive solder paste on a base substrate to establish an electrical connection is provided. The method includes applying conductive solder paste over a stencil, and within an opening of the stencil to contact the base substrate therebeneath. In embodiments, a squeegee can be used to scrape some of the conductive solder paste off of the stencil, leaving behind some of the conductive solder paste within the opening. Subsequently, the stencil can be removed at a speed of more than 200 millimeters per second to help reduce the end-of-track bump ultimately formed at the end of the conductive solder paste that remains after the stencil is removed.


Find Patent Forward Citations

Cheng, Bo. (2023). Method of manufacturing a conductive track on a board via stencil printing (U.S. Patent No. 11622452). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11622452

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…