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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11622445 B1

PDFFull Text
Date of Patent:
Apr. 04, 2023

Filed:

Dec. 17, 2020

Surface-treated copper foil, manufacturing method thereof, copper foil laminate including the same, and printed wiring board including the same

Applicant:

Iljin Materials Co., Ltd., Iksan-si, KR;

Inventors:

Sang Hwa Yoon, Iksan-si, KR;

Chang Yol Yang, Iksan-si, KR;

Jung Woo Seo, Iksan-si, KR;

Young Ho Ryu, Iksan-si, KR;

Kideok Song, Iksan-si, KR;

Eun Sil Choi, Iksan-si, KR;

Won Jin Beom, Iksan-si, KR;

Hyung Cheol Kim, Iksan-si, KR;

Assignee:

ILJIN MATERIALS CO., LTD., Jeollabuk-Do, KR;

Attorney:

Husch Blackwell LLP

Primary Examiner:

Seth Dumbris

Int. Cl.
CPC ...
B32B 15/08 (2006.01); C25D 3/38 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01); B32B 15/20 (2006.01); C25D 7/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); C25D 3/38 (2013.01); C25D 7/00 (2013.01); H05K 3/384 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2457/08 (2013.01); H05K 1/0242 (2013.01); H05K 2201/0338 (2013.01); H05K 2203/0723 (2013.01); Y10T 428/12431 (2015.01);
Abstract

Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 μm to about 0.5 μm and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.

Find Patent Forward Citations

Yoon, Sang. (2023). Surface-treated copper foil, manufacturing method thereof, copper foil laminate including the same, and printed wiring board including the same (U.S. Patent No. 11622445). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11622445

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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