The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2023
Filed:
Aug. 06, 2020
Qualcomm Incorporated, San Diego, CA (US);
Jing Jiang, San Diego, CA (US);
Tingfang Ji, San Diego, CA (US);
Krishna Kiran Mukkavilli, San Diego, CA (US);
Naga Bhushan, San Diego, CA (US);
Joseph Binamira Soriaga, San Diego, CA (US);
Chih Ping Li, San Diego, CA (US);
John Edward Smee, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Various aspects of the present disclosure provide for enabling at least one opportunity to transmit mission critical (MiCr) data and at least one opportunity to receive MiCr data in a time division duplex (TDD) subframe during a single transmission time interval (TTI). The single TTI may be no greater than 500 microseconds. The TDD subframe may be a downlink (DL)-centric TDD subframe or an uplink (UL)-centric TDD subframe. How much of the TDD subframe is configured for the at least one opportunity to transmit the MiCr data and how much of the TDD subframe is configured for the at least one opportunity to receive the MiCr data may be adjusted based on one or more characteristics of the MiCr data. The MiCr data may have a low latency requirement, a high priority requirement, and/or a high reliability requirement. Various other aspects are provided throughout the present disclosure.