The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

Jun. 24, 2019
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Kei Yokokawa, Tokyo, JP;

Narihiro Nakamoto, Tokyo, JP;

Toru Fukasawa, Tokyo, JP;

Hitoshi Arai, Tokyo, JP;

Tomohiro Takahashi, Tokyo, JP;

Kensuke Iwaki, Tokyo, JP;

Takamichi Kono, Tokyo, JP;

Keisuke Fujiwara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/42 (2006.01); H01Q 9/04 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/42 (2013.01); H01Q 9/0421 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/065 (2013.01);
Abstract

A conductor ground plane provided on a dielectric substrate and provided with a patch antenna and a conductor ground plane provided on the side of a dielectric substrate having a through hole are bonded by solder in a state where the through hole and the patch antenna are arranged to face each other, and a conductor ground plane provided on the back side of the dielectric substrate and a conductor ground plane provided on a dielectric substrate are bonded by solder.


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