The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2023
Filed:
Apr. 16, 2021
Applicant:
Socionext Inc., Kanagawa, JP;
Inventors:
Toshihiro Nakamura, Yokohama, JP;
Taro Fukunaga, Yokohama, JP;
Assignee:
SOCIONEXT INC., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); H01L 23/5286 (2013.01); H01L 24/48 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A semiconductor chip includes a first cell row constituted by I/O cells arranged in the X direction and a second cell row constituted by I/O cells arranged in the first direction, spaced from the first cell row by a predetermined distance in the Y direction. A plurality of external connecting pads include pads each connected with any of the I/O cells and a reinforcing power supply pad that is not connected with any of the I/O cells and is connected with a pad for power supply. The reinforcing power supply pad is placed to lie in a region between the first cell row and the second cell row.